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LOCTITE ECCOBOND UF 3812 is a reworkable epoxy resin bottom filling designed specifically for CSP, WLCSP, and BGA applications. This low viscosity material formula can be moved at room temperature without the need for additional preheating. It quickly solidifies at moderate temperatures to minimize pressure on other components. The high glass transition temperature and high fracture toughness of this material can provide excellent protection for solder joints during thermal cycling.

• Halogen-free 

• Low viscosity materials move at room temperature without the need for additional preheating

• High Tg and high fracture toughness can provide excellent protection for solder joints during thermal cycling

• Room temperature flow capacity