LOCTITE ABLESTIK 2025D
LOCTITE ABLESTIK 2025D (known as Ablebund 2025D) is a non-conductive, thermosetting, chip bonding adhesive that has minimal leakage and good adhesion to many different substrates. This product has excellent hot/wet chip shear strength and 260 ° C reflow soldering capability, suitable for lead-free applications, typically used in PBGA, FlexBGA, and stacked BGA packaging applications.
Has good adhesion to various substrates
High heat/wet mold shear strength
Minimum bleeding
260 ° C reflow soldering capability, suitable for lead-free applications
| Technical information | |
| RT modulus shear strength | 20kgf |
| Coefficient of thermal expansion | 48 ppm/°C |
| Thermal expansion coefficient, higher than Tg | 140 ppm/°C |
| Extractable ion content, chloride (CI -) | 9ppm |
| Extractable ion content, sodium (Na+) | 9.ppm |
| Extractable ion content, potassium (K+) | 9ppm |
| Curing method | heating |
| Thermal conductivity | 0.4 W/mK |
| application | Chip bonding |
| Tensile modulus@ 250 °C | 116N/square millimeter (16800 pounds per square inch) |
| Thermal shear strength | 3.5kgf |
| Viscosity, Bolefi CP51@ 25°C Speed 5 rpm | 11500 mPa.s (cP) |
| Thixotropic index | four point four |
Tel021-68753051
Eamilmaster@zhenweihg.com
AddressRoom 105, No.4 Times Square, Lane 299, Jiangchang West Road, Shanghai, China
